Laser Marking in the Semiconductor Industry

Direct Part Marking in the Semiconductor Industry

Semiconductor laser marking is a process that uses a laser marking system to mark semiconductor devices with identifying numbers, barcodes, or logos. The laser marking system directs a beam of high-energy light at the semiconductor device, which heats the surface of the device and causes it to change color. This change in color is used to create the markings that can provide part branding or traceability.

Semiconductor laser marking is an important part of the semiconductor manufacturing process, as it allows for the easy identification of semiconductor devices. In addition, semiconductor laser marking can be used for other purposes, such as part marking and barcoding.

IC packages

Crystal oscillators


Moulded packages

Glass epoxy PCB

Wire sheath

Epoxy package

Flexible PCB

Semiconductor manufacturing is the process used to create semiconductor devices, which are electronic components made from semiconductor materials. These materials are typically silicon-based, but can also be made from other materials such as germanium, gallium arsenide, or silicon-germanium. The parts are commonly used in computers, hand-held electronic devices such as mobile phones, tablets and electronic book readers, wearable devices and consumer electronics.

This manufacturing process starts with wafer fabrication, in which these materials are purified and shaped into thin disks called wafers. These wafers are then subjected to a series of complex processes that add electrical components such as transistors and other circuit elements. Also, many parts require laser marking before they are packaged and shipped to the customer.

Semiconductor manufacturing is a highly complex and precise process, and even small changes in the fabrication process can significantly impact the finished product's performance. That said, using precise and professional equipment is paramount, including the right semiconductor laser marking systems.

These laser marking machines are used to create semiconductor devices such as semiconductor chips, wafers, printed circuit boards (PCBs), integrated circuits (ICs), and other semiconductor devices.

Micro and 2D Code marking on IC Chips

Until recently, IC chips were only marked with lot codes. However, a growing need for encoded data has prompted many manufacturers to start using 2D codes.


Laser markers have a very small beam spot, making them perfect for applications with a limited marking area. Micromarking - which is typically impossible for most systems - can be accomplished with the right laser. Various marking styles can also be selected, from shallow marking to deep engraving.

Marking silicon wafer

It's vital to keep surface damage to a minimum when marking a finished wafer, otherwise dust and debris can form. That's why UV and green lasers are the optimal wavelengths for these applications

Marking LED ceramic package

Due to space limitations, ceramic packages often use 2D codes to contain all the necessary traceability information.

Plating and Coating IC Chip Removal

KEYENCE’s 3-Axis laser markers can mark the top surface of IC chips and remove plating or coatings within the same process. Since the laser accurately scans only along the edges of the IC, flash burrs over the leads can be removed without causing damage to the inside of the package.

Removal of gold plating on terminals

To prevent solder wicking, lasers are used to remove the gold plating from connector terminals.
In the past, masks were used to avoid unnecessary plating. Today, connectors are designed smaller and thinner, and the pitches between the terminals are narrower. Consequently, it has become common practice to apply plating and then remove it with a laser for micron accuracy.

Removal thin-film coil coating

Previously, removers or edged tools were generally used to remove thin-film coating from coils. Now, laser markers have become useful because they require no consumables and ensure stable results.

Resin coating removal

Chemicals are often used to remove resins on defective moulds so that the moulds can be analyzed. However, chemicals can damage the internal circuit and require multiple man-hours of work. Using a laser marker to remove resin saves running costs and time.

Benefits of Laser Marking Semiconductor Parts

In the semiconductor industry, semiconductor laser marking is used extensively for part marking. This is because semiconductor laser marking machines offer many advantages over other types of machines. For example, semiconductor laser marking machines can mark very small parts with a high degree of accuracy. In addition, semiconductor laser marking machines are very fast, so they can mark large quantities of parts in a short period of time.

The process is also highly versatile, allowing for a wide range of semiconductor part designs and markings. Additionally, semiconductor laser marking is an environmentally friendly alternative to other part marking processes, such as etching or screen printing, because it does not use any consumables. As a result, semiconductor laser marking machines are an essential part of the semiconductor industry.

KEYENCE - The Right Laser Marking Partner for the Semiconductor Industry

KEYENCE manufactures and develops custom laser marking systems for the semiconductor industry. We serve as an extension of your team to help you improve and automate your factory. Additionally, our knowledgeable team and trained sales force can help solve challenging and technical problems related to semiconductor part marking.

Ready to improve your semiconductor-related processes? Contact us today or view our laser marking systems to learn how we can help.